High-temperature packaged devices are widely used in aerospace, oil exploration, deep space exploration, and other extreme environments. Their ultimate temperature cycle reliability is crucial for ensuring long-term stable operation of the devices.

Chiller liquid cooling technology introduces cooling fluid into the interior of servers or cooling modules through direct or indirect contact, achieving efficient heat exchange.

The Temperature Forcing System can simulate extreme temperature change environments, accelerating the exposure of issues such as thermal stress, material expansion mismatch, and soldering defects in high-power laser packaging, providing crucial data support for failure analysis.

Rapid thermal oxidation (RTO) technology, with its second-level response and atomic-level precision, has become a key process in high-end chip manufacturing.